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  general description the MAX5900/max5901 are sot23/tdfn hot-swap con- trollers that allow a circuit card to be safely hot-plugged into a live backplane without causing a glitch on the power-supply rail. these devices operate from -9v to -100v and provide the simplest hot-swap solution by eliminating all external components except an external n-channel mosfet. the MAX5900/max5901 limit the inrush current to the load and provide a circuit-breaker function for overcurrent protection. during startup, the circuit-breaker function is disabled and the MAX5900/max5901 limit the inrush cur- rent by gradually turning on the external mosfet. once the external mosfet is fully enhanced, the circuit-break- er function is enabled and the MAX5900/max5901 pro- vide overcurrent protection by monitoring the voltage drop across the external mosfet? on-resistance. the MAX5900/max5901 include an undervoltage lock- out (uvlo) function, on/ off control input, and a power- good status output, pgood (MAX5900) or pgood (max5901). a built-in thermal shutdown feature is also included to protect the external mosfet in case of over- heating. the MAX5900/max5901 offer latched or autoretry fault management and are available with 200mv, 300mv, or 400mv circuit-breaker thresholds. both the MAX5900 and max5901 are available in small sot23 and tdfn pack- ages, and are specified for the extended -40? to +85? temperature range. for specific ordering information see the selector guide at the end of the data sheet. _________________________applications ? requires no external sense resistor features ? wide -9v to -100v operation ? requires no external sense resistor ? drives external n-channel mosfet ? limits inrush current ? circuit-breaker function ? less than 1ma quiescent current ? on/ off input permits load power-supply control and sequencing ? adjustable undervoltage lockout ? power-good output with 100v rating ? latching or automatic retry fault management ? thermal shutdown helps protect the external mosfet ? space-saving 6-pin sot23 and tdfn packages MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers ________________________________________________________________ maxim integrated products 1 drain gnd ( ) are for max5901 only. gate 16 on/off 5 pgood (pgood) v ee MAX5900 max5901 sot23 top view 2 34 pin configurations MAX5900 v ee on/off hot-swap controller gnd -48v 50w isolated power supply v 1 - on/off lucent jwo50a1 v 1 + gate drain pgood irf540ns gnd backplane circuit card fuse typical operating circuits 19-2077; rev 5; 1/07 for pricing, delivery, and ordering information, please contact maxim/dallas direct! at 1-888-629-4642, or visit maxim? website at www.maxim-ic.com. ordering information part temp range pin- package pkg code MAX5900 _ _eut+t* -40 c to +85 c 6 sot23-6 u6f-6 MAX5900_ _ett+t* -40 c to +85 c 6 tdfn-ep** t633-2 max5901 _ _eut+t* -40 c to +85 c 6 sot23-6 u6f-6 max5901_ _ett+t* -40 c to +85 c 6 tdfn-ep** t633-2 * for specific part numbers, see selector guide at end of data sheet. + denotes lead-free package. ** ep = exposed pad. typical operating circuits continued at end of data sheet. simple swapper is a trademark of maxim integrated products, inc. telecom line cards network routers base-station line cards network switches servers pin configurations continued at end of data sheet.
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers 2 _______________________________________________________________________________________ absolute maximum ratings electrical characteristics (v ee = -9v to -100v, gnd = 0v, on/ off open circuit, t a = -40? to +85?, unless otherwise noted. typical values are at v ee = -48v and t a = +25?.) (notes 1, 2) stresses beyond those listed under ?bsolute maximum ratings?may cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specificatio ns is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. terminal voltage (with respect to gnd, unless otherwise noted) v ee, drain, pgood, pgood ............................-120v to +0.3v on/ off to v ee .........................................................-0.3v to +4v gate to v ee ......................................................... -0.3v to +12v current into any pin............................................................?ma continuous power dissipation (t a = +70?) 6-pin sot23 (derate 9.1mw/? above +70?)...........727mw 6-pin tdfn (derate 18.2mw/? above +70?) ........1454mw junction to case thermal resistance, jc (tdfn) ........8.5?/w maximum junction temperature .....................................+150? storage temperature range .............................-60? to +150? lead temperature (soldering, 10s) .................................+300? parameter symbol conditions min typ max units supply voltage v ee -100 -9 v supply current i gnd measured at gnd 0.5 1.3 ma v ee = -36v to -72v 7.5 9.5 11.6 v ee = -100v 8 10 11.6 external gate drive v gs v gate - v ee v ee = -9v 6 7 v load voltage slew-rate magnitude sr | dv drain /dt |, c load = 10?, v ee = -9v to -36v 4.5 10 17 v/ms default uvlo v uvlo |v ee | increasing -34.5 -31.5 -28.5 v uvlo hysteresis 3.5 v on/ off input resistance r on/ off 20 32 50 k ? drain to v ee resistance r dvee 466 k ? on/ off reference threshold v on/ off (v on/ off - v ee ) increasing 1.14 1.26 1.38 v on/ off hysteresis 140 mv start delay (note 3) t on 150 300 500 ms on/ off off delay (note 4) t off v gate - v ee < 1v 9 20 32 ms max590_ _aeut 170 200 240 max590_ _beut 265 300 345 circuit-breaker threshold v cb v drain - v ee max590_ _ceut 365 400 455 mv c gate = 1nf 1.5 3 c gate = 4.7nf 2.5 4.5 circuit-breaker delay (note 5) t cb (v drain - v ee ) > v cb until (v gate - v ee ) < 1v, 200mv overdrive step c gate = 10nf 4 6 ? restart delay (note 3) t rs after circuit-breaker event, max590_a_eut only 150 300 500 ms
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers _______________________________________________________________________________________ 3 note 1: all currents into device pins are positive, all currents out of device pins are negative, and all voltages are referenced to gnd, unless otherwise noted. note 2: all specifications are 100% tested at t a = +25?. specifications over -40? to +85? are guaranteed by characterization. note 3: this is the delay time from a valid on condition until v gs begins rising. valid on conditions are: the device is not in undervolt- age lockout; on/ off is not driven low; and the device is not in thermal shutdown. note 4: this is the delay from a valid low on on/ off until v gs falls. pulses on on/ off less than t off are ignored, offering glitch immunity. note 5: guaranteed by design, not production tested. note 6: for a detailed description, see the power-good output section. electrical characteristics (continued) (v ee = -9v to -100v, gnd = 0v, on/ off open circuit, t a = -40? to +85?, unless otherwise noted. typical values are at v ee = -48v and t a = +25?.) (notes 1, 2) parameter symbol conditions min typ max units pgood (pgood) assertion threshold (note 6) v pg v drain - v ee ; max590_a, max590_l only 0.75 ? v cb mv pgood (pgood) output low voltage v ol MAX5900, v pgood - v ee , i ol = 1ma; max5901, v pgood - v ee , i ol = 1ma 0.6 1.65 v power-good output open- drain leakage current i oh v pgood - v ee = 100v (MAX5900); v pgood - v ee = 100v (max5901) 0.2 10 ? thermal shutdown temperature t sd junction temperature +125 c thermal shutdown hysteresis t hy 15 c typical operating characteristics (v ee = -48v, gnd = 0v, and t a = +25?, unless otherwise noted. see figure 6 for test circuits.) 0.5 0.7 0.6 0.9 0.8 1.0 1.1 -100 -60 -80 -40 -20 0 supply current vs. input voltage MAX5900/01 toc01 input voltage (v) supply current (ma) 100k ? from on/off to gnd 0.55 0.65 0.60 0.75 0.70 0.85 0.80 0.90 -50 0 25 -25 50 75 100 125 supply current vs. temperature MAX5900/1 toc02 temperature ( c) i ee (ma) v ee = -75v v ee = -48v v ee = -12v -37.5 -35.5 -36.5 -34.5 -33.5 -32.5 -31.5 -30.5 -29.5 -28.5 -27.5 -26.5 -25.5 default undervoltage lockout vs. temperature max9500/01 toc03 temperature ( c) v uvlo (v) -50 0 25 -25 50 75 100 125 decreasing |v ee | increasing |v ee |
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers 4 _______________________________________________________________________________________ 7.0 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 -100 -80 -60 -40 -20 0 gate drive voltage vs. input voltage MAX5900/1 toc04 input voltage (v) v gs (v) 150 250 200 350 300 400 450 -50 25 50 -25 0 75 100 125 restart delay vs. temperature MAX5900/01 toc05 temperature ( c) t rs (ms) 5ms/div startup waveforms (r l = open, c l = 10 f) a b d c MAX5900/1 toc07 0 0 0 0 a: v gs, 10v/div c: v out, 50v/div b: i in, 200ma/div d: pgood , 50v/div 5ms/div startup waveforms (r l = 40 ? , c l = 10 f) a b d c MAX5900/1 toc08 0 0 0 a: v gs, 10v/div c: v out, 50v/div b: i in, 1a/div d: pgood , 50v/div 5ms/div startup waveforms (r l = 40 ? , c l = 100 f) a b d c MAX5900/1 toc09 0 0 0 a: v gs, 10v/div c: v out, 50v/div b: i in, 1a/div d: pgood , 50v/div 0 2 s/div circuit-breaker event (c gate = 1000pf, v overdrive = 20mv) a b c MAX5900/1 toc10 0 0 0 d: pgood , 50v/div c: v gs, 10v/div b: v ds , 500mv/div typical operating characteristics (continued) (v ee = -48v, gnd = 0v, and t a = +25?, unless otherwise noted. see figure 6 for test circuits.) startup waveforms (r l = 90 ? , c l = 100 f) MAX5900/01 toc06 0 40ms/div 0 0 0 a b c d a: v gs , 5v/div c: v ee , 50v/div b: i in , 1a/div d: v drain , 40v/div 6 8 7 10 9 11 12 -100 -60 -80 -40 -20 0 slew rate vs. v ee MAX5900/01 toc12 v ee (v) slew rate (v/ms) t a = +120 c t a = +25 c t a = -40 c 2 s/div circuit-breaker event (c gate = 1000pf, v overdrive = 200mv) a b c MAX5900/1 toc11 0 0 0 d: pgood , 50v/div c: v gs, 10v/div b: v ds , 500mv/div
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers _______________________________________________________________________________________ 5 detailed description the MAX5900/max5901 are integrated hot-swap con- troller ics contained in 6-pin sot23/tdfn packages. they allow a board to be safely hot plugged into a live backplane without causing a glitch on the power-sup- ply rail. they are well suited for -48v telecom power systems, allowing a cost-effective, simple, and com- pact design. the MAX5900/max5901 operate from -9v to -100v to cover the standard telecom voltage range, and to serve more generalized applications. these devices require only an external n-channel power mos- fet to provide hot-swap control. figure 1 shows a functional diagram of the MAX5900/max5901. the MAX5900/max5901 control an external n-channel power mosfet placed in the negative power-supply pathway. when power is first applied, the MAX5900/ max5901 keep the mosfet turned off. the MAX5900/ max5901 hold the mosfet off indefinitely if on/ off is held low, if the supply voltage is below the undervolt- age lockout level, or if the die temperature exceeds +125?. if none of these conditions exist for 300ms (typ), the MAX5900/max5901 begin to gradually turn on the mosfet. during this turn-on phase, the MAX5900/max5901 slowly enhance the mosfet, figure 1. functional diagram v ee v ee on/off gnd MAX5900 max5901 gate 34.5k ? * 466k ? * 1k ? * 828k ? * drain *relative tolerance 1%, absolute tolerance 20% typical. control logic pgood (pgood) ( ) are for the max5901 only. v ee 3v n pin MAX5900 max5901 name function 11v ee negative supply voltage input and external n-channel mosfet source connection 2 2 drain drain sense input for external n-channel mosfet. connect drain as close as possible to the mosfet? drain and use wide circuit traces to assure good thermal coupling between the MAX5900/max5901 and the mosfet (see the layout guidelines section ) . 3 3 gate gate drive output for external n-channel mosfet 4 4 gnd ground connection. 5 pgood power-good output. pgood is an n-channel, open-drain, active-low output, referenced to v ee . 5 pgood power-good output. pgood is an n-channel, open-drain, active-high output, referenced to v ee . 6 6 on/ off on/ off control input. on/ off is referenced to v ee . drive on/ off above 1.38v or leave unconnected to enable the device. drive on/ off below 1v to disable the device. on/ off is also used to adjust the uvlo threshold. see the under- voltage lockout section in the applications information . internally clamped to nominally 3v through a 1k ? resistor (see figure 1). ep exposed pad (tdfn only). connect to v ee . pin description
allowing the voltage on the load, i.e. the drain of the mosfet, to fall no faster than 10v/ms (typ). the inrush current to the load is thus limited to a level proportional to the load capacitance, and the constant load voltage slew rate. after the mosfet is fully enhanced, and the load voltage is settled to its final value, the MAX5900a/ max5901a and MAX5900l/max5901l monitor the volt- age drop from the mosfet? drain-to-source (v ds ). if the voltage drop exceeds 75% of the circuit-breaker threshold the MAX5900a/max5901a or MAX5900l/ max5901l turn off the mosfet, disconnecting the load immediately. because the circuit-breaker function is not activated until the mosfet is fully enhanced, it takes approximately 10ms for the MAX5900a/ max5901a or MAX5900l/max5901l to react to an out- put short circuit at startup. if no circuit-breaker fault exists, the power-good output is asserted. then, if any of four conditions exist, the power-good output deasserts and the mosfet is turned off . the four con- ditions are: the voltage across the mosfet exceeds the circuit-breaker threshold; the supply voltage magni- tude falls below the undervoltage lockout level; the die temperature exceeds +125?; or on/ off is forced low. after a circuit-breaker fault, the MAX5900l/max5901l keep the mosfet off until the power is cycled, or the part is reset by toggling on/ off low for at least 20ms (typ). after a circuit-breaker fault, the MAX5900a/ max5901a automatically restart in 300ms (typ). all ver- sions automatically restart after a thermal fault, or an undervoltage shutdown, if the fault condition goes away for at least 300ms (typ). on/ off offers external control of the MAX5900/ max5901, facilitating power-supply sequencing, and may also be used to change the uvlo level. uvlo keeps the external mosfet switched off as long as the magnitude of the input voltage is less than a desired level. a power-good output, pgood (MAX5900) or pgood (max5901), asserts when the external mosfet is fully enhanced and the drain-source voltage is at least 25% below the circuit-breaker threshold. pgood and pgood are open-drain outputs referenced to v ee , and can withstand up to 100v above v ee . a thermal shutdown feature protects the external mos- fet by turning it off if the die temperature of the MAX5900/max5901 exceeds +125?. the MAX5900/ max5901 must be in good thermal contact with the external mosfet. see the layout guidelines section in the applications information . a circuit-breaker function monitors the voltage across the external mosfet, v ds , and turns off the mosfet if v ds exceeds the circuit-breaker threshold, v cb . the circuit-breaker function is enabled after the mosfet is fully enhanced. three threshold voltage options are available?00mv, 300mv, and 400mv. one version is available with no circuit-breaker function. circuit-break- er fault management for the MAX5900/max5901 is offered with two different configurations?atched and automatic retry. latched circuit breaker after a circuit-breaker trip event, the latched versions (MAX5900l/max5901l) drive gate to v ee , turning off the external mosfet, and pgood (pgood) is deasserted. a latched-off condition needs to be reset by toggling on/ off low for at least 20ms, or by cycling the power supply, v ee . automatic retry circuit breaker after a circuit-breaker trip event, the automatic retry versions (MAX5900a/max5901a) drive gate to v ee , turning off the external mosfet, and pgood (pgood) is deasserted. if the start conditions are met for a full 300ms (t rs ) the start sequence is initiated. the start conditions are: the device is not in uvlo; on/ off is not driven low; and the device is not in thermal shut- down. no circuit breaker for the versions without a circuit-breaker MAX5900n (max5901n), pgood (pgood) is asserted when the mosfet is fully enhanced. once powered up, the MAX5900n/max5901n ignore the mosfet drain-to- source voltage (v ds ) for applications where a circuit- breaker function is not desired. applications information on / off control input the on/ off control input provides three hot-swap functions: external on/ off control; setting of the uvlo level; and resetting after a circuit-breaker event has caused the MAX5900l/max5901l to turn off the exter- nal mosfet. pulling on/ off to v ee for at least 20ms (t off ) forces the MAX5900/max5901 to turn off the external mosfet (see figure 2 for a circuit example). to reset the MAX5900l/max5901l after a circuit- breaker event, toggle on/ off to v ee for at least 20ms (t off ). on/ off can be used to sequence power supplies. connecting a capacitor from on/ off to v ee will delay the rise of on/ off proportional to the capacitance and input impedance of on/ off , typically 32k ? (figure 3). MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers 6 _______________________________________________________________________________________
turn-on and turn-off delays after power is applied, or on/ off is released, there is a 300ms delay (t on ) before the gate ramp is started. this delay is also the automatic restart time delay. in the event of a circuit-breaker condition or an over- temperature fault condition, the turn-off delay is less than 2?. an undervoltage condition must exist for at least 20ms (t off ) before the MAX5900/max5901 turn off the external mosfet. on/ off must be held low for at least 20ms (t off ) before the MAX5900/max5901 turn off the external mosfet. turn-off delay minimizes spu- rious shutdowns due to noisy signals or momentary voltage spikes, as well as preventing accidental resetting of the circuit-breaker latch (MAX5900l/ max5901l). thermal shutdown a thermal shutdown feature helps protect the external mosfet. if the die temperature of the MAX5900/ max5901 exceeds +125?, the mosfet is turned off. for accurate performance, the MAX5900/max5901 must be in close thermal contact with the external mosfet (see the layout guidelines section). due to the low power dissipation of the MAX5900/max5901, its junction temperature will typically be within a few degrees of the mosfet. all versions of the MAX5900/ max5901 automatically restart from a temperature fault when the junction temperature drops below +110?. undervoltage lockout the MAX5900/max5901 turn off the external mosfet if the magnitude of the input voltage is below the level set by on/ off for longer than 20ms (t off ). if on/ off is left unconnected, the lockout voltage (v uvlo ) defaults to -31.5v. v uvlo may also be set to any value within the power-supply range by using external resistors. to set the lockout voltage to a value between -9v and -100v, use a resistor-divider connected between gnd and v ee , with the center node of the divider connected to on/ off . for example, use a 3k ? resistor (r1 in figure 2) from on/ off to v ee and calculate the other resistor, r2, using: where v uvlo is the desired lockout voltage, and v on/off is the on/ off reference threshold specified in the electrical characteristics table (typically 1.26v). figure 2 shows an example circuit with v uvlo set for -20v. to defeat the uvlo, simply connect a single 100k ? resistor between on/ off and gnd, as shown in figure 4. rr v uvlo 21 126 1 = ? ? ? ? ? ? ? . MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers _______________________________________________________________________________________ 7 hot-swap controller optional -48v v ee gnd r2 47k ? r1 3k ? MAX5900 gnd on/off on/off max5901 dgnd hot-swap controller #1 v ee gnd c 2c MAX5900 gnd on/off hot-swap controller #2 v ee v ee gnd on/off max5901 MAX5900 max5901 figure 2. programmed -20v lockout with optional optocoupler on/off control figure 3. power-supply sequencing figure 4. defeating undervoltage lockout hot-swap controller -48v v ee gnd 100k ? MAX5900 gnd on/off max5901
power-good output the power-good output, pgood (pgood), is open- drain and asserts when the external mosfet is fully enhanced and v ds is less than v pg (75% of the circuit- breaker threshold, v cb ). for versions without the circuit- breaker function (MAX5900n/max5901n), pgood (pgood) asserts when the external mosfet is fully enhanced. pgood (pgood) deasserts within 2? when a circuit- breaker event occurs or if the die temperature exceeds +125?. pgood (pgood) deasserts if |v ee | < |v uvlo | for longer than 20ms or on/ off is held low for longer than 20ms. the MAX5900 pgood is active-low and the max5901 pgood is active-high. both are open-drain n-channel mosfets with their sources connected to v ee , and can withstand up to 100v. selecting a circuit-breaker threshold the MAX5900a/max5901a and the MAX5900l/ max5901l offer a circuit-breaker function to protect the external mosfet and the load from the potentially damaging effects of excessive current. as load current flows through the external mosfet, a voltage, v ds, is generated from drain to source due to the mosfet? on-resistance r ds(on) . the MAX5900a/max5901a and MAX5900l/max5901l monitor v ds when the external mosfet is fully enhanced. if v ds exceeds the circuit- breaker threshold, the external mosfet is turned off and pgood (pgood) is deasserted. to accommodate different mosfets and different load currents, the MAX5900/max5901 are available with cir- cuit-breaker threshold voltages of 200mv, 300mv, and 400mv. the circuit-breaker function is intended to disconnect the load if a gross overcurrent or short-circuit condition occurs. for calculating the circuit-breaker threshold, use the mosfet? r on at the worst possible operating condition, and add a 25% overcurrent margin to the maximum circuit current. for instance, if a mosfet has an r on of 0.06 ? at t a = +25?, and a normalized on- resistance factor of 1.75 at t a = +130? (from the mosfet data sheet), the r on used for calculation is the product of these two numbers, or (0.06 ? ) x (1.75) = 0.105 ? . then, if the maximum current is expected to be 2a, using a 25% margin, the current for calculation is (2a) x (1.25) = 2.5a. the resulting minimum circuit- breaker threshold is then the product of these two results, or (0.105 ? ) x (2.5a) = 0.263v. the next highest minimum available threshold is 0.265v of the max590_ _beut, which is an ideal choice given these parameters. using this method to choose a circuit- breaker threshold allows the circuit to operate under worst-case conditions without causing a circuit-breaker fault, but the circuit-breaker function will still operate if a short-circuit or gross overcurrent condition occurs. see table 1 for mosfet suggestions. the MAX5900n/ max5901n have no circuit-breaker function. for these parts choose an external mosfet that meets the load requirements. determining inrush current determining a circuit? inrush current is necessary to help choose the proper mosfet. the MAX5900/ max5901 regulate the inrush current by means of con- trolling the load voltage slew rate, but inrush current is also a function of load capacitance. determine inrush current using: where c is the load capacitance, and sr is the MAX5900/max5901 load voltage slew-rate magnitude from the electrical characteristics table. for example, assuming a load capacitance of 100?, and using the typical value of 10v/ms for the slew rate, the inrush current is 1a typical. if the maximum possible load voltage slew rate is used, the maximum inrush current calculates to 1.7a. choose a mosfet with a maximum pulsed current specification that exceeds the maximum inrush current. MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers 8 _______________________________________________________________________________________ m a xim u m i loa d ( a ) su gg ested exter n al m o sf et su gg ested m a xim pa r t 0.25 irfl110 m ax 590_ _c e u t 0.5 irfl4310 m ax 590_ _be u t 1 irfr3910 m ax 590_ _c e u t 2 irf540ns m ax 590_ _be u t 3 irf1310ns m ax 590_ _be u t 4 irf1310ns m ax 590_ _c e u t suggested external mosfets v in = -9v to -90v is == c dv dt cr
layout guidelines good thermal contact between the MAX5900/ max5901 and the external mosfet is essential for the thermal shutdown feature to operate effectively. place the MAX5900/max5901 as close as possible to the drain of the external mosfet, and use wide circuit board traces for good heat transfer. see figure 5 for an example of a pc board layout. chip information transistor count: 678 process: bicmos MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers _______________________________________________________________________________________ 9 figure 5. circuit board layout example ground power in power out m1 sot-223 sdg u1 sot23-6 MAX5900/max5901 v + - gnd on/off v ee gate drain pgood (pgood) v in 100 f MAX5900 max5901 100k ? v + - gnd on/off v ee gate drain pgood (pgood) v in v 50k ? MAX5900 max5901 v + - gnd on/off v ee gate drain pgood (pgood) v in MAX5900 max5901 100k ? v + - gnd on/off v ee gate drain pgood (pgood) 48v MAX5900a max5901a 50k ? scope scope + - gnd on/off v ee gate drain pgood (pgood) 48v c l MAX5900 max5901 50k ? r l scope scope scope scope scope + - gnd on/off v ee gate drain pgood (pgood) 48v MAX5900 max5901 50k ? 50k ? scope scope scope (a) supply current (c) gate drive voltage (e) turn-on waveforms (b) v uvlo (d) retry timeout (f) circuit-breaker event figure 6. test circuits
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers 10 ______________________________________________________________________________________ selector guide + denotes lead-free package. part circuit-breaker function circuit-breaker threshold (mv) power-good output logic top mark MAX5900nneut+t none none active-low aaqv MAX5900aaeut+t autoretry 200 active-low aaqj MAX5900abeut+t autoretry 300 active-low aaqk MAX5900aceut+t autoretry 400 active-low aaql MAX5900laeut+t latched 200 active-low aaqm MAX5900lbeut+t latched 300 active-low aaqn MAX5900lceut+t latched 400 active-low aaqo max5901nneut+t none none active-high aaqw max5901aaeut+t autoretry 200 active-high aaqp max5901abeut+t autoretry 300 active-high aaqq max5901aceut+t autoretry 400 active-high aaqr max5901laeut+t latched 200 active-high aaqs max5901lbeut+t latched 300 active-high aaqt max5901lceut+t latched 400 active-high aaqu part circuit-breaker function circuit-breaker threshold (mv) power-good output logic top mark MAX5900nnett+t none none active-low ajt MAX5900aaett+t autoretry 200 active-low aju MAX5900abett+t autoretry 300 active-low ajv MAX5900acett+t autoretry 400 active-low ajw MAX5900laett+t latched 200 active-low ajx MAX5900lbett+t latched 300 active-low ajy MAX5900lcett+t latched 400 active-low ajz max5901nnett+t none none active-high aka max5901aaett+t autoretry 200 active-high akb max5901abett+t autoretry 300 active-high akc max5901acett+t autoretry 400 active-high akd max5901laett+t latched 200 active-high ake max5901lbett+t latched 300 active-high akf max5901lcett+t latched 400 active-high akg sot23 tdfn
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers ______________________________________________________________________________________ 11 v ee on/off hot-swap controller gnd -48v 50w isolated power supply gnd indiv v+ 1m ? 39k ? max5003* gate drain pgood ir540ns gnd *max5003 is a 110v pwm controller. circuit card max5901 backplane fuse typical operating circuits (continued) 3 2 1 4 5 6 MAX5900 max5901 v ee drain gate on/off pgood (pgood) gnd * exposed pad ( ) are for max5901 only. * exposed pad connected to v ee . tdfn 3mm x 3mm top view pin configurations (continued)
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers 12 ______________________________________________________________________________________ 6lsot.eps package information (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation, go to www.maxim-ic.com/packages .)
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers ______________________________________________________________________________________ 13 6, 8, &10l, dfn thin.eps h 1 2 21-0137 package outline, 6,8,10 & 14l, tdfn, exposed pad, 3x3x0.80 mm package information (continued) (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation, go to www.maxim-ic.com/packages .)
MAX5900/max5901 -100v, sot23/tdfn, simple swapper hot-swap controllers maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a maxim product. no circu it patent licenses are implied. maxim reserves the right to change the circuitry and specifications without notice at any time. 14 ____________________maxim integrated products, 120 san gabriel drive, sunnyvale, ca 94086 408-737-7600 2007 maxim integrated products is a registered trademark of maxim integrated products, inc. common dimensions symbol min. max. a 0.70 0.80 d 2.90 3.10 e 2.90 3.10 a1 0.00 0.05 l 0.20 0.40 pkg. code n d2 e2 e jedec spec b [(n/2)-1] x e package variations 0.25 min. k a2 0.20 ref. 2.300.10 1.500.10 6 t633-1 0.95 bsc mo229 / weea 1.90 ref 0.400.05 1.95 ref 0.300.05 0.65 bsc 2.300.10 8 t833-1 2.00 ref 0.250.05 0.50 bsc 2.300.10 10 t1033-1 2.40 ref 0.200.05 - - - - 0.40 bsc 1.700.10 2.300.10 14 t1433-1 1.500.10 1.500.10 mo229 / weec mo229 / weed-3 0.40 bsc - - - - 0.200.05 2.40 ref t1433-2 14 2.300.10 1.700.10 t633-2 6 1.500.10 2.300.10 0.95 bsc mo229 / weea 0.400.05 1.90 ref t833-2 8 1.500.10 2.300.10 0.65 bsc m o229 / weec 0.300.05 1.95 ref t833-3 8 1.500.10 2.300.10 0.65 bsc m o229 / weec 0.300.05 1.95 ref -drawing not to scale- h 2 2 21-0137 package outline, 6,8,10 & 14l, tdfn, exposed pad, 3x3x0.80 mm 2.300.10 mo229 / weed-3 2.00 ref 0.250.05 0.50 bsc 1.500.10 10 t1033-2 package information (continued) (the package drawing(s) in this data sheet may not reflect the most current specifications. for the latest package outline info rmation, go to www.maxim-ic.com/packages .) revision history pages changed at rev 5: 1?, 10, 12?4


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